Title:
MODULE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/202972
Kind Code:
A1
Abstract:
Provided is a module which comprises: a first insulating layer; an electronic component that is mounted on a lower surface of the first insulating layer; wiring that is formed on an upper surface of the first insulating layer and is connected to the electronic component via a first through hole which passes through the first insulating layer; a first layer that is formed either below the electronic component or above the wiring; a first annular metal layer that surrounds the corresponding one of either the electronic component or the wiring between the first insulating layer and the first layer; and a first resin that fills a first space surrounded by the first insulating layer, the first layer, and the first annular metal layer and seals the corresponding one of either the electronic component or the wiring. A first hole that connects the first space with the outside is formed in at least one of the first insulating layer and the first annular metal layer.
Inventors:
TAKANO TAKAYUKI (JP)
SASAJIMA YUICHI (JP)
SASAJIMA YUICHI (JP)
Application Number:
PCT/JP2020/008656
Publication Date:
October 08, 2020
Filing Date:
March 02, 2020
Export Citation:
Assignee:
TAIYO YUDEN KK (JP)
International Classes:
H01L25/07; H01L25/04; H01L25/18
Domestic Patent References:
| WO2018110383A1 | 2018-06-21 |
Foreign References:
| JP2014200825A | 2014-10-27 | |||
| JP2005183571A | 2005-07-07 | |||
| JP2016031969A | 2016-03-07 |
Attorney, Agent or Firm:
KATAYAMA, Shuhei (JP)
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