Title:
MODULE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/014348
Kind Code:
A1
Abstract:
A module (101) is provided with: a substrate (1) that has a first surface (1a); a first component (41) that is mounted on the first surface (1a), with at least a part thereof covered by a first conductive film (71); a sealing resin (6) that is disposed so as to cover the first surface (1a) and the first component (41); and a shield film (8) that covers part of the surface of the sealing resin (6) on the far side from the substrate (1). The surface of the sealing resin (6) on the far side from the substrate (1) has a shielded region (51) covered by the shield film (8), and a non-shielded region (52) not covered by the shield film (8) when viewed from a direction perpendicular to the first surface (1a). The non-shielded region (52) overlaps with at least part of the first conductive film (71).
Inventors:
ODA TETSUYA (JP)
Application Number:
PCT/JP2021/024982
Publication Date:
January 20, 2022
Filing Date:
July 01, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H05K9/00
Domestic Patent References:
| WO2018194012A1 | 2018-10-25 |
Foreign References:
| JP2019080029A | 2019-05-23 | |||
| JP2019195034A | 2019-11-07 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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