Title:
SEMICONDUCTOR MEMBER MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/014347
Kind Code:
A1
Abstract:
This semiconductor member manufacturing method includes: a laser machining step in which a laser light condensing spot is formed on an object including a semiconductor, and the condensing spot is moved relative to the object along a line extending in a circular manner when viewed from a Z-direction, which intersects the surface of the object where the laser light is incident, thereby forming a modified region in the object along said line, and a crack that extends from the modified region; and a separation step in which, after the laser machining step, a portion of the object is separated using the modified region and the crack as boundaries, thereby forming a semiconductor member from the object.
Inventors:
SAKAMOTO TAKESHI (JP)
Application Number:
PCT/JP2021/024973
Publication Date:
January 20, 2022
Filing Date:
July 01, 2021
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
B23K26/53; H01L21/304
Foreign References:
| JP2014189478A | 2014-10-06 | |||
| JP2017069308A | 2017-04-06 | |||
| JP2019186559A | 2019-10-24 | |||
| JP2017119310A | 2017-07-06 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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