Title:
MODULE, AND SERVER
Document Type and Number:
WIPO Patent Application WO/2019/077831
Kind Code:
A1
Abstract:
This module is provided with: a cooling unit for cooling a heat-generating component provided to a substrate; a connection tube which is connected to the cooling unit; and a fixing part which is provided in a position where stress exerted on the cooling unit from the connection tube is mitigated, and which fixes the connection tube.
Inventors:
OCHIAI SYOJI (JP)
Application Number:
PCT/JP2018/027925
Publication Date:
April 25, 2019
Filing Date:
July 25, 2018
Export Citation:
Assignee:
NEC PLATFORMS LTD (JP)
International Classes:
H01L23/473; G06F1/20; H05K7/20
Foreign References:
| JP2013232505A | 2013-11-14 | |||
| JP2013225599A | 2013-10-31 | |||
| JPH0548238A | 1993-02-26 | |||
| JP2011253984A | 2011-12-15 | |||
| JPH04316783A | 1992-11-09 | |||
| JP2007281430A | 2007-10-25 | |||
| JP2000338173A | 2000-12-08 | |||
| JP2017203293A | 2017-11-16 |
Other References:
See also references of EP 3699957A4
Attorney, Agent or Firm:
TANAI Sumio et al. (JP)
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