Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2020/071491
Kind Code:
A1
Abstract:
A module (101) is equipped with: a substrate (1) having a principal surface (1u); a plurality of electronic components (41, 42) positioned on the principal surface (1u); a sealing resin (3) which covers the principal surface (1u) and the plurality of electronic components (41, 42); a ground electrode (14) positioned on the principal surface (1u) or inside the substrate (1); a conductive layer (6) which covers the sealing resin (3) and is electrically connected to the ground electrode (14); and a magnetic member (5). The magnetic member (5) includes a magnetic member plate-shaped section (51) positioned so as to cover at least part of the sealing resin (3) and a magnetic member wall-shaped section (52) positioned in a wall shape between some of the electronic components. The module (101) is also equipped with a metal pin or metal wire which is connected to the ground electrode (14) and is provided along the magnetic member wall-shaped section (52).
Inventors:
OTSUBO YOSHIHITO (JP)
MURAKITA NAOYA (JP)
MURAKITA NAOYA (JP)
Application Number:
PCT/JP2019/039161
Publication Date:
April 09, 2020
Filing Date:
October 03, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K9/00; H01L23/00; H01L23/28; H01L25/04; H01L25/18
Domestic Patent References:
| WO2018159290A1 | 2018-09-07 | |||
| WO2016181954A1 | 2016-11-17 | |||
| WO2018101384A1 | 2018-06-07 |
Foreign References:
| JP2017174949A | 2017-09-28 | |||
| US8012868B1 | 2011-09-06 | |||
| US20120061816A1 | 2012-03-15 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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