Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2020/071492
Kind Code:
A1
Abstract:
A module (101) is equipped with: a substrate having a principal surface (1u); a plurality of electronic components (41, 42, 43) positioned on the principal surface (1u); a sealing resin (3) which covers the principal surface (1u) and the plurality of electronic components (41, 42, 43), and has a trench (16) between some of the electronic components (41, 42, 43); a ground electrode positioned on the principal surface (1u); a conductive layer (6) for covering the sealing resin (3); and a magnetic member. The conductive layer (6) is electrically connected to the ground electrode by a connecting conductor (62) provided so as to pass through the sealing resin (3). The magnetic member includes a magnetic member plate-shaped section positioned so as to cover the sealing resin (3) and a magnetic member wall-shaped section (52) positioned in a wall shape inside the trench (16). The connecting conductor (62) and the magnetic member wall-shaped section (52) are both formed inside the trench (16) and fill the trench (16) in said formed state.
Inventors:
OTSUBO YOSHIHITO (JP)
ODA TETSUYA (JP)
ODA TETSUYA (JP)
Application Number:
PCT/JP2019/039162
Publication Date:
April 09, 2020
Filing Date:
October 03, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H05K9/00; H01L23/28; H01L25/04; H01L25/18
Domestic Patent References:
| WO2018159290A1 | 2018-09-07 | |||
| WO2016186103A1 | 2016-11-24 | |||
| WO2018101384A1 | 2018-06-07 | |||
| WO2016181954A1 | 2016-11-17 |
Foreign References:
| JP2017174949A | 2017-09-28 | |||
| JP2016072411A | 2016-05-09 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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