Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2021/020331
Kind Code:
A1
Abstract:
This module (101) is provided with: a substrate (1) having a first main surface (1a); a first component (41) mounted to the first main surface (1a); a first wire group having a plurality of wires (5) that are arranged so as to straddle the first component (41); a first ground conductor (21) disposed inside the substrate (1); and a first conductor via group (81) having a plurality of via conductors that connect the first ground conductor (21) and the respective wires (5) belonging to the first wire group, wherein the first component (41) is enclosed by the first wire group, the first conductor via group (81), and the first ground conductor (21).
Inventors:
OTSUBO YOSHIHITO (JP)
KITAZUME TAKAHIRO (JP)
UEJIMA TAKANORI (JP)
KITAZUME TAKAHIRO (JP)
UEJIMA TAKANORI (JP)
Application Number:
PCT/JP2020/028653
Publication Date:
February 04, 2021
Filing Date:
July 27, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L25/00; H05K9/00
Domestic Patent References:
| WO2018164158A1 | 2018-09-13 |
Foreign References:
| JP2001044305A | 2001-02-16 | |||
| US20170263568A1 | 2017-09-14 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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