Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2021/020332
Kind Code:
A1
Abstract:
A module (103) is provided with: a substrate (1) having a first major surface (1a); a first component (41) mounted on the first major surface (1a); a first conductor column group including a plurality of conductive columns (5) arrayed on the first major surface (1a) so as to follow at least a part of the outer periphery of the first component (41); a first ground conductor (21) disposed inside the substrate (1); a first conductive via group (81) including a plurality of via conductors connecting the ends of the conductive columns (5) on the side closer to the first major surface (1a) with the first ground conductor (21); and a shield film (8) disposed so as to cover the first component (41) from above. When viewed in a cross section taken in a plane perpendicular to the first major surface (1a), the first component (41) is surrounded at least partially by the first conductor column group, the first conductive via group (81), and the first ground conductor (21).
Inventors:
OTSUBO YOSHIHITO (JP)
KITAZUME TAKAHIRO (JP)
UEJIMA TAKANORI (JP)
KITAZUME TAKAHIRO (JP)
UEJIMA TAKANORI (JP)
Application Number:
PCT/JP2020/028654
Publication Date:
February 04, 2021
Filing Date:
July 27, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H05K9/00
Domestic Patent References:
| WO2018164158A1 | 2018-09-13 | |||
| WO2016181954A1 | 2016-11-17 |
Foreign References:
| US20180374798A1 | 2018-12-27 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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