Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2021/205930
Kind Code:
A1
Abstract:
A module (101) comprises: a substrate (1) having a first surface (1a); a plurality of components (3a, 3b, 3c) mounted on the first surface (1a); a resin film (6) covering the plurality of components (3a, 3b, 3c) along the shape of the plurality of components (3a, 3b, 3c) and also covering a part of the first surface (1a); and a shield film (8) formed to overlap the resin film (6). The first surface (1a) has a ground electrode (7) provided thereon. The resin film (6) includes an opening portion (6a). The shield film (8) is connected to the ground electrode (7) via the opening portion (6a).
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| JPH04306865 | SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF |
Inventors:
OTSUBO YOSHIHITO (JP)
KITA RYOICHI (JP)
NOMURA TADASHI (JP)
KITA RYOICHI (JP)
NOMURA TADASHI (JP)
Application Number:
PCT/JP2021/013334
Publication Date:
October 14, 2021
Filing Date:
March 29, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/28; H01L25/04; H01L25/18; H05K9/00
Domestic Patent References:
| WO2018194012A1 | 2018-10-25 |
Foreign References:
| US20130082367A1 | 2013-04-04 | |||
| US20120020039A1 | 2012-01-26 | |||
| US20190051611A1 | 2019-02-14 | |||
| JP2018093014A | 2018-06-14 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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