Title:
MODULE
Document Type and Number:
WIPO Patent Application WO/2023/085110
Kind Code:
A1
Abstract:
A module (100) comprises a substrate (110), a first component (120), a sealing resin (150), and a shield film (160). The substrate (110) has a first surface (111). The first component (120) is mounted on the first surface (111). The sealing resin (150) seals the first component (120) at least laterally. The first component (120) has an exposed surface (121). The exposed surface (121) is exposed from the sealing resin (150) on the side opposite the substrate (110) side. The shield film (160) is made of a metal and covers the first component (120) and the sealing resin (150). The shield film (160) has a first contact section (161). The first contact section (161) is in contact with the exposed surface (121). The first contact section (161) includes a layer formed of a plurality of crystal grains. The plurality of crystal grains have mutually different longitudinal directions when viewed from a direction orthogonal to the first surface (111).
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Inventors:
KATSUBE AKIO (JP)
SHINKAI HIDEKI (JP)
SHINKAI HIDEKI (JP)
Application Number:
PCT/JP2022/040144
Publication Date:
May 19, 2023
Filing Date:
October 27, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/28; H03H9/25
Domestic Patent References:
| WO2021124806A1 | 2021-06-24 |
Foreign References:
| JPH04332131A | 1992-11-19 | |||
| JP2018056393A | 2018-04-05 | |||
| US20190139902A1 | 2019-05-09 | |||
| JP2014183181A | 2014-09-29 | |||
| JP2018064089A | 2018-04-19 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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