Title:
MOISTURE-CURABLE HOT-MELT RESIN COMPOSITION, ADHESIVE AGENT FOR ELECTRONIC COMPONENTS, AND CURED BODY
Document Type and Number:
WIPO Patent Application WO/2023/145942
Kind Code:
A1
Abstract:
This moisture-curable hot-melt resin composition is a reactant of a polyol (A) and a polyisocyanate compound (B), and contains a urethane prepolymer having an isocyanate group. The polyol (A) includes a polyether polycarbonate polyol (a1) and a polyol (a2) that is different from the polyether polycarbonate polyol (a1). The polyol (a2) is at least one selected from the group consisting of polyester polyols and polycarbonate polyols. The moisture-curable hot-melt resin composition has an initial PUSH adhesive strength of 3 kgf/cm2 or more.
Inventors:
SHIMAMURA KAZUYORI (JP)
Application Number:
PCT/JP2023/002904
Publication Date:
August 03, 2023
Filing Date:
January 30, 2023
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08G18/30; C08G18/08; C08G18/10; C08G18/40; C08G18/42; C08G18/44; C09J11/06; C09J175/06; C09J175/08
Foreign References:
| JP2020128461A | 2020-08-27 | |||
| CN113881388A | 2022-01-04 | |||
| CN113980631A | 2022-01-28 | |||
| JPH04214713A | 1992-08-05 | |||
| CN113462339A | 2021-10-01 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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