Title:
MOISTURE-CURABLE POLYURETHANE HOT-MELT ADHESIVE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/082423
Kind Code:
A1
Abstract:
Provided is a moisture-curable polyurethane hot-melt adhesive (PUR) that, when heated, produces less hazardous isocyanate gas, and is safe and easy for a user to handle. This moisture-curable polyurethane hot-melt adhesive comprises 100 parts by weight of a urethane pre-polymer which is a product obtained from a reaction between an excessive amount of diphenylmethane diisocyanate and a mixture of a crystalline polyester polyol and a non-crystalline polyester polyol and/or a non-crystalline polyether polyol, and 5-20 parts by weight of a surface-modifying silica gel containing an amino group. Preferable as the surface-modifying silica gel is a silica gel to which a residual group of a silane oligomer, which is a hydrolytic product of aminoalkyl(di or tri)alkoxy silane, is linked.
Inventors:
KINOSHITA NORIHIKO (JP)
KOBAYASHI KENJI (JP)
KOBAYASHI KENJI (JP)
Application Number:
PCT/JP2018/017744
Publication Date:
May 02, 2019
Filing Date:
May 08, 2018
Export Citation:
Assignee:
TAIYO SEIKI CO (JP)
International Classes:
C09J175/06; C08G18/10; C08G18/40; C08G18/42; C09C3/12; C09J11/04; C09J175/08
Foreign References:
| JP2000506187A | 2000-05-23 | |||
| JP2005320513A | 2005-11-17 | |||
| JP2010506018A | 2010-02-25 | |||
| JP2016121214A | 2016-07-07 |
Other References:
SANUKI SUMIKOMOTOYOSHI FUMITAKENAGAOKA SHIGERUMAJIMA HIROSHI, THE JOURNAL OF THE SURFACE FINISHING SOCIETY OF JAPAN, vol. 50, no. 1, 1999, pages 84
Attorney, Agent or Firm:
MINORI PATENT PROFESSION CORPORATION (JP)
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