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Title:
MOISTURE-CURING HOT MELT ADHESIVE FOR IC CARD
Document Type and Number:
WIPO Patent Application WO/2010/137490
Kind Code:
A1
Abstract:
Provided is a moisture-curing hot melt adhesive, which has superior overall performance, including heat resistance, adhesiveness, and solidification performance, and with which there is no reduction in the resulting IC card quality or productivity. Also provided is an IC card obtained by applying such a moisture-curing hot melt adhesive. The moisture-curing hot melt adhesive for an IC card comprises a urethane prepolymer (A) having a chemical structure (A1) derived from a polyester polyol (a1) that has isocyanate groups at the terminals and that is obtained by reacting a diol and a dicarboxylic acid having 10 carbons or fewer. The moisture-curing hot melt adhesive has a shear modulus with non-moisture curing that is between (1×104) and(1×108) Pa at 40ºC and between (1×100) and (1×104) at 80ºC. An IC card can be ideally produced by bonding a decorative material and a substrate using the moisture-curing hot melt adhesive.

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Inventors:
MATSUKI YUICHI (JP)
YAMAUCHI MASARU (JP)
YOSHIDA YOSHIO (JP)
HAYAKAWA TADASHI (JP)
TAKAMORI AI (JP)
Application Number:
PCT/JP2010/058343
Publication Date:
December 02, 2010
Filing Date:
May 18, 2010
Export Citation:
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Assignee:
HENKEL AG & CO KGAA (DE)
MATSUKI YUICHI (JP)
YAMAUCHI MASARU (JP)
YOSHIDA YOSHIO (JP)
HAYAKAWA TADASHI (JP)
TAKAMORI AI (JP)
International Classes:
C09J175/04; C09J175/06; C09J175/08; G06K19/077
Domestic Patent References:
WO2006080400A12006-08-03
Foreign References:
JP2003327647A2003-11-19
JP2001262112A2001-09-26
JP2000148959A2000-05-30
JP2005036128A2005-02-10
JP2005332384A2005-12-02
JPH0525455A1993-02-02
JPH08113770A1996-05-07
JPH11323302A1999-11-26
JP2006273986A2006-10-12
JP2008094960A2008-04-24
JP2008094959A2008-04-24
JP2007254512A2007-10-04
JP2004155860A2004-06-03
JPH11345298A1999-12-14
JP2001022912A2001-01-26
JP2000148959A2000-05-30
JP2005036128A2005-02-10
JP2005332384A2005-12-02
Other References:
See also references of EP 2436745A4
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (JP)
Mitsuo Tanaka (JP)
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