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Title:
MOLD ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2018/143534
Kind Code:
A1
Abstract:
A mold assembly according to an embodiment of the present invention comprises, as main constituent elements, first mold block units, second mold block units, a mold connection unit, and a reinforcing frame. The mold connection unit connects the multiple first mold block units and the multiple second mold block units such that the multiple first mold block units and the multiple second mold block units maintain a distance therebetween. According to an embodiment of the present invention, when concrete is cast, cured, and solidified between the first mold block units and the second mold block units, a connection structure between the first mold block units and the second mold block units can be easily released and the mold connection unit can be easily separated from the concrete.

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Inventors:
YOO DAE SIK (KR)
Application Number:
PCT/KR2017/011016
Publication Date:
August 09, 2018
Filing Date:
September 29, 2017
Export Citation:
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Assignee:
YOO DAE SIK (KR)
International Classes:
E04G11/06; E04G17/02; E04G17/04; E04G17/06; E04G17/14
Foreign References:
KR20170004923A2017-01-11
JP3025622U1996-06-21
KR101616867B12016-04-29
KR20120081456A2012-07-19
KR100381681B12003-04-26
Attorney, Agent or Firm:
CHEON JEE INTERNATIONAL PATENT & LAW (KR)
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