Title:
MOLD FOR INJECTION MOLDING
Document Type and Number:
WIPO Patent Application WO/2024/048929
Kind Code:
A1
Abstract:
According to one embodiment of the present disclosure, a mold for injection molding may comprise: a first core; a second core configured to form at least a portion of a cavity by being coupled to face the first core as the second core moves along a first direction; a plurality of third cores which are arranged on the first core and can move in a second direction forming an angle with the first direction, and which are configured to surround at least a portion of the cavity at the time the second core is coupled to face the first core (hereinafter, a mold close state); and a plurality of support pins which are arranged on the first core and support the third cores. In one embodiment, in the mold close state, the support pins may be configured to support one of the third cores that corresponds, so as to put same in close contact with the second core. Various other embodiments may also be possible.
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Inventors:
KIM MINKYU (KR)
PARK MIJI (KR)
BAEK HYANGHEE (KR)
PARK MIJI (KR)
BAEK HYANGHEE (KR)
Application Number:
PCT/KR2023/008167
Publication Date:
March 07, 2024
Filing Date:
June 14, 2023
Export Citation:
Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
B29C45/33; B29C45/27; B29C45/36; B29C45/40; B29C45/64
Foreign References:
| JP2003053789A | 2003-02-26 | |||
| JP2004066699A | 2004-03-04 | |||
| JP2014151465A | 2014-08-25 | |||
| JPH09187843A | 1997-07-22 | |||
| KR20120042208A | 2012-05-03 |
Attorney, Agent or Firm:
LEE, Keon-Joo et al. (KR)
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