Title:
MOLD RELEASE SHEET
Document Type and Number:
WIPO Patent Application WO/2019/044873
Kind Code:
A1
Abstract:
A mold release sheet which is obtained by arranging a resin layer on a substrate, and which is characterized in that: the resin layer contains one or more polymers, each of which contains an olefin component and an unsaturated carboxylic acid component as copolymerization components; the olefin component contains an α-olefin component and an ethylene component; the mass ratio of the α-olefin component to the ethylene component in the resin layer, namely (α-olefin component)/(ethylene component) is from 10/90 to 60/40; the coefficient of kinetic friction between the resin layer surface and the substrate surface is 0.50 or less in cases where the surfaces are superposed on each other; and a sample which is obtained by bonding an acrylic adhesive layer of a resin tape to the resin layer surface of this mold release sheet has a peel strength between the adhesive layer and the resin layer of 0.5 N/cm or less as measured at 25°C, at a peeling angle of 180° and at a peeling rate of 300 mm/minute.
Inventors:
MORIMOTO RYOHEI (JP)
OKUMURA NOBUYASU (JP)
OKUMURA NOBUYASU (JP)
Application Number:
PCT/JP2018/031875
Publication Date:
March 07, 2019
Filing Date:
August 29, 2018
Export Citation:
Assignee:
UNITIKA LTD (JP)
International Classes:
B32B27/00; B32B7/06; B32B27/26; B32B27/30; B32B27/32; C08J7/043; C08J7/046; C09J7/40; C09J133/00
Domestic Patent References:
| WO2014109340A1 | 2014-07-17 | |||
| WO2015186733A1 | 2015-12-10 |
Foreign References:
| JP2016203570A | 2016-12-08 | |||
| JP2008248455A | 2008-10-16 | |||
| JP2017500220A | 2017-01-05 |
Attorney, Agent or Firm:
MORIMOTO INT'L PATENT OFFICE (JP)
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