Title:
MOLD UNIT FOR MANUFACTURING MICROSTRUCTURES
Document Type and Number:
WIPO Patent Application WO/2023/085754
Kind Code:
A1
Abstract:
Disclosed is a mold unit for manufacturing microstructures, the mold unit comprising a first mold for manufacturing microstructures in which a plurality of microneedles are formed on one surface of a base layer. The first mold comprises: a first base part in which first needle grooves for forming the microneedles are formed on the upper surface, and which includes a first embankment protruding to a predetermined height around the region where the first needle grooves are formed; a first edge part which is provided along the periphery of the first base part at a predetermined distance from the first base part, and of which the upper end is provided higher than the first embankment; and a first extension part which extends from the first base part to the first edge part, and of which the upper surface is positioned lower than the region where the first needle grooves are formed.
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Inventors:
KIM YONG HEE (KR)
FAKHRAEILAHIJI SHAYAN (KR)
FAKHRAEILAHIJI SHAYAN (KR)
Application Number:
PCT/KR2022/017518
Publication Date:
May 19, 2023
Filing Date:
November 09, 2022
Export Citation:
Assignee:
IUCF HYU (KR)
International Classes:
B29C39/26; A61M37/00; B29C39/02; B29C39/42; B29L31/00
Foreign References:
| KR102053675B1 | 2019-12-09 | |||
| KR100528802B1 | 2005-11-15 | |||
| JP2012196426A | 2012-10-18 | |||
| JP2017070705A | 2017-04-13 | |||
| US6375148B1 | 2002-04-23 |
Attorney, Agent or Firm:
PARK, Sang Youl (KR)
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