Title:
MOLDING APPARATUS AND MOLDING METHOD
Document Type and Number:
WIPO Patent Application WO/2021/145274
Kind Code:
A1
Abstract:
Provided is a molding apparatus that can save the amount of clear ink used when each layer is formed and suppress a degradation in the quality of the surface of a molded object at the time of flattening. The molding apparatus, which molds the molded object by forming and stacking each layer on the basis of a plurality of slice images indicating a cross-sectional shape and a color scheme of each layer of the molded object, comprises: a color ink ejection position determination means for determining whether to eject each of a plurality of color inks for coloring and having a plurality of colors at each ejection position constituting the layer on the basis of the slice image corresponding to the layer; a clear ink ejection position determination means for determining the necessity of ejecting clear ink to each ejection position on the basis of whether to eject each of the color inks for coloring and having the colors at each ejection position, which is determined in the color ink ejection position determination means; and a layer formation means for ejecting each color ink and clear ink to a color ink head and a clear ink head at each ejection position according to the determination by the color ink ejection position determination means and the clear ink ejection position determination means.
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Inventors:
KAZAANA TAKEAKI (JP)
Application Number:
PCT/JP2021/000418
Publication Date:
July 22, 2021
Filing Date:
January 08, 2021
Export Citation:
Assignee:
MIMAKI ENG CO LTD (JP)
International Classes:
B33Y10/00; B29C64/112; B29C64/393; B33Y30/00; B33Y50/02
Foreign References:
| JP2018030332A | 2018-03-01 | |||
| JP2017196797A | 2017-11-02 | |||
| JP2018149777A | 2018-09-27 |
Attorney, Agent or Firm:
WENO & PARTNERS (JP)
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