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Patent Searching and Data


Title:
MOLDING METHOD AND MOLDING DIE
Document Type and Number:
WIPO Patent Application WO/2021/106074
Kind Code:
A1
Abstract:
The purpose of the present invention is to suppress the generation of wrinkles during a bending process and to shorten the time period for lamination. A molding method according to the present disclosure comprises: a laminating step for forming an intermediate molded article (32) by supplying and laminating a fibrous sheet onto molding surfaces (22A, 22B) of a molding die (20) for forming the intermediate molded article (32); and a bending process step for performing a bending process on the intermediate molded article (32), which is laminated on the molding surfaces (22A, 22B) and has a shape that corresponds to the molding die (20), to yield a molded article. The molding surfaces (22A, 22B) have shapes that correspond to the intermediate molded article (32) to be formed. The second molding surface (22B) is bent with respect to the first molding surface (22A) among the molding surfaces (22A, 22B), and the angle formed by the first molding surface (22A) and the second molding surface (22B) is greater than the bending angle of the cross-section of the molded article to be formed and less than 180 degrees.

Inventors:
KITAZAWA TOSHIKI (JP)
SHIMIZU MASAHIKO (JP)
MANO SHOYA (JP)
Application Number:
PCT/JP2019/046163
Publication Date:
June 03, 2021
Filing Date:
November 26, 2019
Export Citation:
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Assignee:
MITSUBISHI HEAVY IND LTD (JP)
International Classes:
B29C33/42; B29C53/04; B29C65/70; B29C70/28; B29K105/10
Domestic Patent References:
WO2013129075A12013-09-06
Foreign References:
JPH0671742A1994-03-15
US20150053332A12015-02-26
JP2019151083A2019-09-12
Attorney, Agent or Firm:
FUJITA, Takaharu (JP)
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