Title:
MOLDING SYSTEM, SUPPORT ARM, RESIN MOLDING DEVICE, METHOD FOR SUPPORTING SUPPORTED MEMBER, MOLD, AND METHOD FOR PRODUCING MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2021/117713
Kind Code:
A1
Abstract:
Provided is a molding system that enables molding defects to be reduced. According to the present invention, the molding system comprises a first and a second parison formation device, a first and a second mold configured so as to be able to open and close, and a control unit. The first parison formation device is provided with a first extruder, a first accumulator, and a first injection head, and is configured such that a first molten resin is extruded from the first extruder and is accumulated on the first accumulator, and then is injected from the first injection head to form a first parison. The second parison formation device is provided with a second extruder, a second accumulator, and a second injection head, and is configured such that a second molten resin is extruded from the second extruder and is accumulated on the second accumulator, and then is injected from the second injection head to form a second parison. The first and the second parison are injected between the first and the second molds. The control unit is configured so as to determine, on the basis of historical data in a past cycle, a timing to start operation for the first and second parison formation devices and/or the first and second molds in the next cycle.
Inventors:
HARASAWA YUKI (JP)
KATO TAKESHI (JP)
OUCHI TSUTOMU (JP)
FUKUDA TATSUYA (JP)
HAYASHI YOSUKE (JP)
FUNATO TAKAFUMI (JP)
ONO SEIJI (JP)
KATO TAKESHI (JP)
OUCHI TSUTOMU (JP)
FUKUDA TATSUYA (JP)
HAYASHI YOSUKE (JP)
FUNATO TAKAFUMI (JP)
ONO SEIJI (JP)
Application Number:
PCT/JP2020/045650
Publication Date:
June 17, 2021
Filing Date:
December 08, 2020
Export Citation:
Assignee:
KYORAKU CO LTD (JP)
International Classes:
B29C51/02; B29C43/04; B29C43/18; B29C43/36; B29C51/08; B29C51/12; B29C51/26; B29C51/38; B29C51/46
Foreign References:
| JP2019042991A | 2019-03-22 | |||
| JPH06315756A | 1994-11-15 | |||
| JPH0659746A | 1994-03-04 |
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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