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Title:
MOLDING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2015/194600
Kind Code:
A1
Abstract:
The molding system disclosed is a molding system for expanding and molding a metal pipe within a mold. The molding system is provided with: a preliminary molding device that makes a preliminary mold of metal pipe material; a molding device having an air supply unit, which supplies air to the inside of the metal pipe material that has undergone preliminary molding and been heated and expands the same, and a main unit to which a mold is attached; and a cutting device for cutting at least part of the metal pipe after molding. The air supply unit is provided so as not to be disposed on a first line joining the preliminary molding device and the main unit in a plane view and not on a second line joining the cutting unit and the main unit in a plane view.

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Inventors:
ISHIZUKA MASAYUKI (JP)
SAIKA MASAYUKI (JP)
UENO NORIEDA (JP)
KOMATSU TAKASHI (JP)
Application Number:
PCT/JP2015/067503
Publication Date:
December 23, 2015
Filing Date:
June 17, 2015
Export Citation:
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Assignee:
SUMITOMO HEAVY INDUSTRIES (JP)
International Classes:
B30B13/00; B21D26/033; B21D43/04; B21D43/28
Foreign References:
JP2008529798A2008-08-07
JP2001355765A2001-12-26
JP2000246361A2000-09-12
JPH06292929A1994-10-21
Other References:
See also references of EP 3159150A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Yoshiki Hasegawa (JP)
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