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Patent Searching and Data


Title:
MOTHERBOARD AND COMPUTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/020451
Kind Code:
A1
Abstract:
Disclosed in the present application are a motherboard and a computing device. The motherboard comprises a base board and an expansion board, wherein the base board is configured to have a base element and an external interface provided thereon; and the expansion board is configured to expand the function of the base board. The base board is coupled to a second external interface of the expansion board by means of a first external interface on the base board. A traditional motherboard is split, and by means of the reasonable division of a processor small system and a peripheral system, a base board, which contains only the processor small system, and an expansion board for expanding input/output and management are formed. The degree to which an expansion element has an impact on the base board is thus reduced, such that the expansion element can be flexibly replaced according to actual requirements. Moreover, a commercially available motherboard can be quickly provided according to service requirements, such that the development cycle and development costs of the motherboard are reduced.

Inventors:
YAO YIMIN (CN)
HUANG CHENG (CN)
NIU YUANJUN (CN)
JU HAIQIANG (CN)
CHENG YONGGUANG (CN)
SHI YING (CN)
Application Number:
PCT/CN2022/112634
Publication Date:
February 23, 2023
Filing Date:
August 16, 2022
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G06F1/16; G06F1/18
Foreign References:
CN201845275U2011-05-25
CN107463224A2017-12-12
CN206003169U2017-03-08
CN208848149U2019-05-10
US20200410815A12020-12-31
CN202110961648A2021-08-20
CN202111638881A2021-12-29
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