Title:
MOTOR CONTROL DEVICE AND METHOD FOR ASSEMBLING MOTOR CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2006/030606
Kind Code:
A1
Abstract:
A motor control device wherein the sizes of the device are easily reduced, aligning operation of a power semiconductor module with a board is eliminated and assemblability is improved. The motor control device is provided by mounting the power semiconductor module, which is adhered on a heat sink, on a first board. A spacer is provided between the heat sink and the board, and the power semiconductor module is arranged in the spacer. An edge part of a hole blocks the space between a terminal protruding from a side part of the power semiconductor module and the heat sink.
Inventors:
ISOMOTO KENJI (JP)
NOHARA SHUHEI (JP)
NAGATOMO SHIGEKATSU (JP)
NOHARA SHUHEI (JP)
NAGATOMO SHIGEKATSU (JP)
Application Number:
PCT/JP2005/015213
Publication Date:
March 23, 2006
Filing Date:
August 22, 2005
Export Citation:
Assignee:
YASKAWA DENKI SEISAKUSHO KK (JP)
ISOMOTO KENJI (JP)
NOHARA SHUHEI (JP)
NAGATOMO SHIGEKATSU (JP)
ISOMOTO KENJI (JP)
NOHARA SHUHEI (JP)
NAGATOMO SHIGEKATSU (JP)
International Classes:
H02M1/00; H05K7/20
Foreign References:
| JPH0444190U | 1992-04-15 | |||
| JP2004151009A | 2004-05-27 | |||
| JP2002325467A | 2002-11-08 | |||
| JPH09283886A | 1997-10-31 |
Download PDF: