Title:
MOUNTING SUBSTRATE MANUFACTURING METHOD AND MOUNTING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/054538
Kind Code:
A1
Abstract:
The purpose of the present invention is to reduce positional error of an LED chip due to a post-transfer flow of a linking agent over a substrate to be transferred onto. Specifically, a mounting substrate manufacturing method for transferring and mounting an LED chip onto a substrate to be transferred onto comprises: a guide layer forming step of forming a guide layer in a region around a region to be transferred into, which is a region into which at least a part of the LED chip on the substrate to be transferred onto is to be transferred, in such a way that the region to be transferred into has a shape recessed from the region around the region to be transferred into; a linking agent inserting step of inserting a linking agent for linking the LED chip and the substrate to be transferred onto in the region to be transferred into; and a transfer step of transferring the LED chip into the region to be transferred into.
Inventors:
YAMAMOTO KIYOHITO (JP)
ARAI YOSHIYUKI (JP)
MIZUTANI YOSHIHITO (JP)
ARAI YOSHIYUKI (JP)
MIZUTANI YOSHIHITO (JP)
Application Number:
PCT/JP2019/034780
Publication Date:
March 19, 2020
Filing Date:
September 04, 2019
Export Citation:
Assignee:
TORAY ENG CO LTD (JP)
International Classes:
H01L33/48; H01L33/62
Foreign References:
| JP2016512347A | 2016-04-25 | |||
| JP2017135301A | 2017-08-03 | |||
| JP2018060993A | 2018-04-12 | |||
| JP2017539088A | 2017-12-28 | |||
| JP2015038957A | 2015-02-26 | |||
| US20170373228A1 | 2017-12-28 |
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