Title:
MULTI-LAYER FLEXIBLE PRINTED CIRCUIT BOARD HAVING IMPEDANCE MATCHING PATTERN BUILT THEREIN, AND ULTRASONIC ELEMENT MODULE
Document Type and Number:
WIPO Patent Application WO/2023/068506
Kind Code:
A1
Abstract:
A multi-layer flexible printed circuit board according to an embodiment of the present invention comprises: a ground electrode region comprising a ground electrode pattern arranged on one surface of the multi-layer flexible printed circuit board, and an acoustic impedance pattern embedded in a lower portion of the ground electrode pattern and formed of a conductive material; a signal electrode region spaced apart from the ground electrode region on the one surface of the multi-layer flexible printed circuit board and comprising a signal electrode pattern for applying a voltage to ultrasonic elements; and a bending region that connects between the ground electrode region and the signal electrode region, comprises a ground wiring connected to the ground electrode pattern, and is bent.
Inventors:
PARK JONGCHEOL (KR)
JUNG JOONTAEK (KR)
YANG CHUNGMO (KR)
JUNG JOONTAEK (KR)
YANG CHUNGMO (KR)
Application Number:
PCT/KR2022/011984
Publication Date:
April 27, 2023
Filing Date:
August 11, 2022
Export Citation:
Assignee:
KOREA ADVANCED INST SCI & TECH (KR)
International Classes:
H05K1/02; B06B1/06; H03H9/02; H05K1/14; H05K3/28
Foreign References:
| KR20180096298A | 2018-08-29 | |||
| KR20110004673A | 2011-01-14 | |||
| KR20150122472A | 2015-11-02 | |||
| JP2018160739A | 2018-10-11 | |||
| KR20100083090A | 2010-07-21 |
Attorney, Agent or Firm:
NURY PATENT LAW FIRM (KR)
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