Title:
MULTI-LAYER INSULATION MATERIAL, AND METHOD FOR PRODUCING MULTI-LAYER INSULATION MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/243690
Kind Code:
A1
Abstract:
A multi-layer insulation material according to the present invention contains an insulation layer containing inorganic fibers and silicon dioxide particles, and satisfies condition (a) and/or condition (b). Condition (a): the insulation layer is formed by layering two or more layers, and the two or more insulation layers exhibit some degree of difference therebetween in thickness and/or mass per unit area. Condition (b): the buffer layer, which comprises a fiber molded body containing fibers and a binder or comprises a foam molded body containing a foamed body, is formed by layering two or more layers, and the two or more buffer layers exhibit some degree of difference therebetween in thickness and/or mass per unit area.
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Inventors:
SASAKI SHU (JP)
UI TAKEHIRO (JP)
UI TAKEHIRO (JP)
Application Number:
PCT/JP2023/022269
Publication Date:
December 21, 2023
Filing Date:
June 15, 2023
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01M10/658; H01M10/625; H01M10/647; H01M10/651; H01M50/289
Foreign References:
| JP3208491U | 2017-01-12 | |||
| US20080057334A1 | 2008-03-06 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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