MULTILAYER BODY AND METHOD FOR PRODUCING SAME

WIPO Patent Application WO/2021/172470

A1

The present invention provides: a multilayer body wherein base materials formed from a metal, a resin and the like are firmly bonded to each other even in cases where the base materials are not subjected to a primer treatment or the like; and a method for producing this multilayer body.　A multilayer body which sequentially comprises a base material (X), an adhesive layer (Y) and a base material (Z) in this order, and which is characterized in that: the adhesive layer (Y) contains a hydrogenated block copolymer (A) that is obtained by hydrogenating a block copolymer (P) which contains a polymer block (a) that is composed of a structural unit derived from an aromatic vinyl compound and a polymer block (b) that is composed of a structural unit derived from a conjugated diene; the mass ratio of the polymer block (a) to the polymer block (b), namely (a)/(b) is from 1/99 to 50/50; and the storage elastic modulus G' of the adhesive layer (Y) at 100°C is from 1.2 × 105 to 4.0 × 105 Pa.

JPS5177676	KABENITAISHI JIKOSETSUCHAKUSHIURU PURASUCHITSUKUTAIRU OYOBI DOTOBUTSU
JP6523673	Molded containers for blister packs and blister packs
JP4211146	Manufacturing method of composite molded product

KONISHI DAISUKE (JP)
SASAKI HIROMITSU (JP)
TOMISHIMA YUTA (JP)

PCT/JP2021/007194

September 02, 2021

February 25, 2021

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KURARAY CO (JP)

B32B27/00; B29C45/14; B29C65/02

WO2019103048A1	2019-05-31
WO2018143373A1	2018-08-09
WO2020235663A1	2020-11-26
WO2019103048A1	2019-05-31

JP2017008308A	2017-01-12
JPH1029276A	1998-02-03
JP2012502135A	2012-01-26
JP2012502136A	2012-01-26
JP2011132298A	2011-07-07
JP2018024776A	2018-02-15

See also references of EP 4112297A4

OHTANI PATENT OFFICE (JP)

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