Title:
MULTILAYER BODY, PRINTED WIRING BOARD, FLEXIBLE PRINTED WIRING BOARD, ELECTROMAGNETIC WAVE SHIELD AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2021/131565
Kind Code:
A1
Abstract:
The present invention provides: a multilayer body which is able to be produced by a simple method without roughening the surface of a support, while exhibiting excellent adhesion between the support and a metal layer (a metal plating layer) even after a long-term heat resistance test; and a printed wiring board, a flexible printed wiring board and a molded article, each of which uses this multilayer body. The present invention uses a multilayer body which is obtained by sequentially superposing a primer layer (B) and a metal particle layer (C) on a support (A), and which is characterized in that the primer layer (B) contains a primer resin (b1) and silica particles (b2) that are treated with a silane coupling agent.
Inventors:
FUJIKAWA WATARU (JP)
FUKAZAWA NORIMASA (JP)
SHIRAKAMI JUN (JP)
FUKAZAWA NORIMASA (JP)
SHIRAKAMI JUN (JP)
Application Number:
PCT/JP2020/044970
Publication Date:
July 01, 2021
Filing Date:
December 03, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B32B27/20; B32B15/02; B32B15/08; B32B27/42; H05K3/38; H05K9/00
Domestic Patent References:
| WO2014156844A1 | 2014-10-02 |
Foreign References:
| JP2016112704A | 2016-06-23 | |||
| JP2007231125A | 2007-09-13 | |||
| JP2019014188A | 2019-01-31 | |||
| JP2007254527A | 2007-10-04 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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