Title:
MULTILAYER BODY FOR SEMI-ADDITIVE PROCESS AND PRINTED WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2022/097483
Kind Code:
A1
Abstract:
The present invention provides: a planar multilayer body for a semi-additive process for double side connection, said multilayer body being capable of forming a wiring line that has a rectangular cross-sectional shape that is favorable for a circuit wiring line without using a vacuum device and without requiring surface roughening by means of chromic acid or permanganic acid, formation of a surface modification layer by means of an alkali, or the like, while exhibiting high adhesion between a base material and a conductor circuit and having less undercut and good design reproducibility; and a printed wiring board which uses this multilayer body for a semi-additive process. It was found that a double side connected printed wiring board, which has good design reproducibility and a rectangular cross-sectional shape that is favorable for a circuit wiring line, is able to be formed by: forming a through hole in a multilayer body that is obtained by sequentially stacking a silver particle layer (M1) and a copper layer (M2) having a thickness of from 0.1 μm to 2 μm on both surfaces of an insulating base material (A), said through hole penetrating both surfaces of the multilayer body; forming a patterned resist on the conductive silver particle layer (M1) by forming a copper or nickel layer on the surface of the through hole; and performing electrolytic copper plating. This finding led to the completion of the present invention.
Inventors:
FUKAZAWA NORIMASA (JP)
FUJIKAWA WATARU (JP)
MURAKAWA AKIRA (JP)
SHIRAKAMI JUN (JP)
FUJIKAWA WATARU (JP)
MURAKAWA AKIRA (JP)
SHIRAKAMI JUN (JP)
Application Number:
PCT/JP2021/038871
Publication Date:
May 12, 2022
Filing Date:
October 21, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
H05K3/24; H05K3/38; H05K3/42
Domestic Patent References:
| WO2020003878A1 | 2020-01-02 | |||
| WO2020003877A1 | 2020-01-02 | |||
| WO2020003879A1 | 2020-01-02 | |||
| WO2020003880A1 | 2020-01-02 | |||
| WO2020003881A1 | 2020-01-02 |
Foreign References:
| JP2010021163A | 2010-01-28 | |||
| JPH08232072A | 1996-09-10 | |||
| JP2005101398A | 2005-04-14 | |||
| JP2007122952A | 2007-05-17 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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