Title:
MULTILAYER CERAMIC CAPACITOR, PACKAGE, AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2024/009997
Kind Code:
A1
Abstract:
A multilayer ceramic capacitor having a first-axis-direction dimension and a second-axis-direction dimension, the former dimension being at least 1.5 times the latter dimension, and comprising a ceramic body and a pair of external electrodes. The external electrodes comprise Cu as a main component and cover end surfaces of the ceramic body. The ceramic body comprises: a multilayer part having a plurality of internal electrodes which comprise Ni as a main component, have been stacked alternately with ceramic layers along the stacking direction parallel to the first axis or the second axis, and extend to connection ends on the end surfaces; and a pair of margins which covers the multilayer part from the width direction of the internal electrodes and includes a low-melting-point metal having a lower melting point than Ni. In each internal electrode, the width dimension, along the width direction, of the connection end is smaller than the width dimension, along the width direction, of the third-axis-direction center.
Inventors:
SHIROTA AYUMI (JP)
Application Number:
PCT/JP2023/024761
Publication Date:
January 11, 2024
Filing Date:
July 04, 2023
Export Citation:
Assignee:
TAIYO YUDEN KK (JP)
International Classes:
H01G4/30; H01G2/06; H01G13/00
Foreign References:
| JPS5671919A | 1981-06-15 | |||
| JP2017212276A | 2017-11-30 | |||
| JP2022075550A | 2022-05-18 | |||
| JP2021044533A | 2021-03-18 |
Attorney, Agent or Firm:
KATAYAMA, Shuhei (JP)
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