Title:
MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
WIPO Patent Application WO/2010/007878
Kind Code:
A1
Abstract:
In a multilayer ceramic substrate manufactured by applying, specifically, a non-shrinkage process, in the case where a plurality of surface via hole conductors reaching a surface are arranged in proximity on one straight line, cracks are easily generated between the surface via hole conductors due to shrinkage in firing.
In the case where a plurality of surface via hole conductors (42) are arranged on one line, dummy via hole conductors (46) are arranged to reach a surface of the laminated body (41) in a state where the dummy via hole conductors are adjacent to the surface via hole conductors (42), and a stress to be a cause of cracks is relaxed.
Inventors:
NOMIYA MASATO (JP)
TENJIKUKATSURA KEN (JP)
TENJIKUKATSURA KEN (JP)
Application Number:
PCT/JP2009/061935
Publication Date:
January 21, 2010
Filing Date:
June 30, 2009
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
NOMIYA MASATO (JP)
TENJIKUKATSURA KEN (JP)
NOMIYA MASATO (JP)
TENJIKUKATSURA KEN (JP)
International Classes:
H05K3/46
Foreign References:
| JPH1065286A | 1998-03-06 | |||
| JP2008042057A | 2008-02-21 | |||
| JP2005311253A | 2005-11-04 |
Attorney, Agent or Firm:
KOSHIBA, MASAAKI (JP)
Masaaki Koshiba (JP)
Masaaki Koshiba (JP)
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