SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

Title:

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2010/007879

Kind Code:

A1

Abstract:

Provided is a semiconductor device manufacturing method by which deterioration of reliability of a bonding section is eliminated, a general bump material can be used and manufacturing cost increase can be suppressed, even when a relatively low-cost package carrier having a low softening temperature is used. At the time of bonding a terminal section (12) of a semiconductor chip (10) with a terminal section (22) of a package carrier (20), the semiconductor chip is heated to a temperature where a package carrier base material (21) softens, the terminal section of the heated semiconductor chip is brought into contact with the terminal section of the package carrier, and the package carrier terminal section and the package carrier base material in the peripheral regions of the package carrier terminal section are softened by heat transfer. Then, in a state where the package carrier terminal section and the package carrier base material in the peripheral regions of the package carrier terminal section are softened, the semiconductor chip terminal section is pressed and bonded to the package carrier terminal section, and the package carrier terminal section is brought into a state where the terminal section is pushed inward from the surface of the package carrier base material.

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Inventors:

TAKAHI MITSUHIRO
TAKAHASHI KAZUYUKI
RAI AKITERU
SEKO TOSHIHARU

Application Number:

PCT/JP2009/061940

Publication Date:

January 21, 2010

Filing Date:

June 30, 2009

Export Citation:

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Assignee:

SHARP KK (JP)
TAKAHI MITSUHIRO
TAKAHASHI KAZUYUKI
RAI AKITERU
SEKO TOSHIHARU

International Classes:

H01L21/60

Foreign References:

JPH0536760A	1993-02-12
JPH10173004A	1998-06-26
JPH11284022A	1999-10-15
JPH06151505A	1994-05-31
JP2000223533A	2000-08-11
JP2001007157A	2001-01-12

Attorney, Agent or Firm:

MASAKI YOSHIFUMI (JP)
Yoshifumi Masaki (JP)

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