Title:
MULTILAYER STRUCTURE INCLUDING INSULATING LAYER
Document Type and Number:
WIPO Patent Application WO/2023/063357
Kind Code:
A1
Abstract:
Provided is a multilayer structure comprising one or more insulating layers, one or more resin layers, and one or more sheets of copper foil that has a smooth surface and a roughened surface, said multilayer structure being characterized in that: the insulating layers contain an olefin-aromatic vinyl compound-aromatic polyene copolymer and a surface modifying agent; the resin layers contain at least one selected from the group consisting of polyimide (PI), a liquid crystal polymer (LCP), polyphenylene ether (PPE), multifunctional aromatic vinyl resin (ODV), epoxy resin, and the composition of the insulating layers; at least one surface of each of the insulating layers is bonded to the smooth surface of the copper foil; and with regard to each of the resin layers, either at least one surface of the resin layer is bonded to the roughened surface of the copper foil and the resin layer is not bonded to the smooth surface of the copper foil, or neither surface of the resin layer is bonded to the copper foil.
Inventors:
ARAI TORU (JP)
KANTO RYOSUKE (JP)
KANTO RYOSUKE (JP)
Application Number:
PCT/JP2022/038065
Publication Date:
April 20, 2023
Filing Date:
October 12, 2022
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B15/08; H05K1/03
Domestic Patent References:
| WO2021112087A1 | 2021-06-10 | |||
| WO2022014599A1 | 2022-01-20 | |||
| WO2022054885A1 | 2022-03-17 | |||
| WO2021112087A1 | 2021-06-10 | |||
| WO2021112088A1 | 2021-06-10 | |||
| WO2018181842A1 | 2018-10-04 | |||
| WO2016114287A1 | 2016-07-21 |
Foreign References:
| JP2009161743A | 2009-07-23 | |||
| JP2010280771A | 2010-12-16 | |||
| JP2022085610A | 2022-06-08 | |||
| JPH06192392A | 1994-07-12 | |||
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| JP2007217706A | 2007-08-30 | |||
| US8404797B2 | 2013-03-26 | |||
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Other References:
MASAO KAWABE ET AL.: "Synthesis of polyfunctional aromatic vinyl copolymer and development of new lPN-type low dielectric loss material using same", JOURNAL OF ELECTRONICS PACKAGING SOCIETY, vol. 12, no. 2, 2009, pages 125 - 129
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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