Title:
MULTILAYER STRUCTURE AND MANUFACTURING METHOD FOR SAME, PACKAGING MATERIAL AND VACUUM HEAT INSULATION BODY USING SAME, AND PROTECTIVE SHEET FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/117791
Kind Code:
A1
Abstract:
The present invention provides: a new multilayer structure that exhibits excellent gas barrier performance and excellent water vapor barrier performance and can maintain the gas barrier performance and the water vapor barrier performance even after bending and that does not cause defective external appearance after a retort process, such as interlayer separation; and a packaging material and a product using said multilayer structure. The present invention pertains to a multilayer structure comprising a base material (X), a layer (Y), and a layer (Z). At least a pair of the layer (Y) and the layer (Z) are laminated so as to be adjacent to each other. The layer (Y) contains a reaction product (D) between an inorganic phosphorus compound (BI) and a metal oxide (A) that includes an aluminum atom. The layer (Z) contains a hydroxyl group-containing resin (W) and a metal compound (R) that includes a metal atom (MR). The molar ratio MMR/MAl of the number of moles (MMR) of the metal atoms (MR) with respect to the number of moles (MAl) of aluminum atoms per unit area in the layer (Y) and the layer (Z) is 0.0005-0.05.
Inventors:
KUZUME SHUHEI (JP)
OSHITA TATSUYA (JP)
OSHITA TATSUYA (JP)
Application Number:
PCT/JP2020/045941
Publication Date:
June 17, 2021
Filing Date:
December 09, 2020
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
B05D3/02; B05D1/36; B05D7/24; B32B9/04; B65D65/40; B65D81/24
Foreign References:
| JP2016150492A | 2016-08-22 | |||
| JP2016040120A | 2016-03-24 | |||
| JP2006218630A | 2006-08-24 |
Attorney, Agent or Firm:
KAMADA Koichi et al. (JP)
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