Title:
MULTILAYER STRUCTURE, AND PACKAGING MATERIAL FOR RETORT USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/215501
Kind Code:
A1
Abstract:
A multilayer structure which contains at least a barrier resin layer (X) and an inorganic barrier layer (Y) that is arranged adjacent to the barrier resin layer (X), while having a thickness of 500 nm or less, and which is characterized in that: the layer (X) is formed of a resin composition (x) that contains an ethylene-vinyl alcohol copolymer (A) and a polyamide (B) at a mass ratio (A/B) of from 55/45 to 98/2; and the ethylene-vinyl alcohol copolymer (A) has an ethylene content of from 20% by mole to 46% by mole and a saponification degree of 90% by mole or more. Consequently, the present invention provides: a multilayer structure which has excellent gas barrier properties and excellent appearance even if a bending process is performed after a stretching process or a retort process; and a packaging material for retort, said packaging material using this multilayer structure.
Inventors:
YOSHIDA KENTARO (JP)
Application Number:
PCT/JP2021/016310
Publication Date:
October 28, 2021
Filing Date:
April 22, 2021
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
B32B9/00; B29C48/21; B29C55/12; B32B7/02; B32B27/30; B32B27/34; B65D65/40; C08F8/12; C08F210/02
Domestic Patent References:
| WO2015174396A1 | 2015-11-19 |
Foreign References:
| JP2015151428A | 2015-08-24 | |||
| JPH05208475A | 1993-08-20 |
Attorney, Agent or Firm:
SETOUCHI INTERNATIONAL PATENT FIRM (JP)
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