MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Title:

MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Document Type and Number:

WIPO Patent Application WO/2005/120142

Kind Code:

A1

Abstract:

In a multilayer wiring board, on an insulating board (10), an arbitrarily formed first conductivity type pattern (12), an insulating material layer (16A) and a second conductivity type pattern (20) formed by applying a conductive material in a pattern on a region corresponding to a graft polymer pattern (18) formed on the insulating material layer are subsequently provided. The multilayer wiring board is provided with a conductive path (22) which electrically connects the first conductivity type pattern and the second conductivity type pattern existing on the insulating substrate. The graft polymer pattern consists of a region wherein a graft polymer exists and a region wherein the graft polymer does not exist, or it consists of a region wherein a hydrophilic graft polymer exists and a region wherein the hydrophobic graft polymer does not exist.

Inventors:

KAWAMURA KOICHI (JP)
KANO TAKEYOSHI (JP)

Application Number:

PCT/JP2005/009915

Publication Date:

December 15, 2005

Filing Date:

May 31, 2005

Export Citation:

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Assignee:

FUJI PHOTO FILM CO LTD (JP)
KAWAMURA KOICHI (JP)
KANO TAKEYOSHI (JP)

International Classes:

H05K3/38; H05K3/46; (IPC1-7): H05K3/46; H05K3/38

Foreign References:

EP1371754A1	2003-12-17
JP2003188498A	2003-07-04
JP2003114525A	2003-04-18

Other References: