Title:
SOLDER JETTING APPARATUS, SOLDER JETTING APPARATUS MANUFACTURING METHOD AND ELECTRONIC COMPONENT SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2005/120141
Kind Code:
A1
Abstract:
A solder jetting apparatus is provided with a solder bath (2); a planar heater (3) and a tube heater (4) as heating means; a solder blowing means (5) which has nozzles (51, 52) protruded for blowing a solder (10) and is attached in the solder bath (2) to be freely lifted; a solder supplying means (6) for supplying the solder blowing means (5) with the solder (10); a lifting means (7), which moves up nozzles (51, 52) from a solder liquid level (11) of the solder bath (2) when soldering, and moves down the nozzles (51, 52) from the solder liquid level (11) of the solder bath (2) to wait; and a placing board (8) for positioning an electric circuit board (100) at a prescribed position.
Inventors:
NAKAOKU KIYOTAKA (JP)
Application Number:
PCT/JP2005/010177
Publication Date:
December 15, 2005
Filing Date:
June 02, 2005
Export Citation:
Assignee:
ANDES ELECTRIC CO LTD (JP)
NAKAOKU KIYOTAKA (JP)
NAKAOKU KIYOTAKA (JP)
International Classes:
B23K1/00; B23K1/08; B23K3/06; H05K3/34; (IPC1-7): H05K3/34; B23K1/08
Foreign References:
| JP2000167661A | 2000-06-20 | |||
| JPS61126960A | 1986-06-14 | |||
| JP2003205363A | 2003-07-22 | |||
| JPH0565472U | 1993-08-31 | |||
| JP2003258418A | 2003-09-12 | |||
| JPS63122750U | 1988-08-10 |
Attorney, Agent or Firm:
Watanabe, Kihei (3rd Floor 26, Kanda Suda-cho 1-chom, Chiyoda-ku Tokyo 41, JP)
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