Title:
MULTILAYER WIRING BOARD AND PRODUCTION METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2023/127367
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a highly-reliable multilayer wiring board that improves the thermal shock resistance of a through electrode. According to the present invention, a multilayer wiring board includes a glass substrate that has a through electrode. A bottom surface part of the through electrode of the glass substrate has a relief at which the absolute value of the difference in height from a first surface of the glass substrate is ±0.5–5 μm. To produce this multilayer wiring board, a glass substrate is irradiated with a laser, a modified part that reaches a first surface is formed inside the glass substrate, and a relief is formed at the first surface of the glass substrate. Then, a hydrofluoric acid–resistant metal layer and/or a first seed layer onto which the shape of the relief has been transferred is formed. Then, after a through hole has been formed using hydrofluoric acid, a second seed layer onto which the shape of the relief has been transferred is formed inside the through hole.
Inventors:
TAKADA TAKEHISA (JP)
Application Number:
PCT/JP2022/043661
Publication Date:
July 06, 2023
Filing Date:
November 28, 2022
Export Citation:
Assignee:
TOPPAN INC (JP)
International Classes:
H01L23/12; H05K3/00; H05K3/40
Foreign References:
| JP2020092270A | 2020-06-11 | |||
| JP2003332739A | 2003-11-21 | |||
| JP2017204527A | 2017-11-16 | |||
| JP2017143140A | 2017-08-17 |
Attorney, Agent or Firm:
DAI-ICHI INTERNATIONAL PATENT OFFICE, P.C. (JP)
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