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Title:
MULTILAYER WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2014/091644
Kind Code:
A1
Abstract:
The present invention improves the degree of freedom with respect to the design of a multilayer wiring substrate comprising a built-in electronic component. A multilayer wiring substrate (1) is provided with: insulating layers (23, 24, 25, 26) having formed therewithin via conductors (33, 34, 35, 36) that have a shape that decreases in diameter from the upper surface side toward the lower surface side thereof; a first stacked body configured by stacking conductive layers (13, 14, 15, 16); an electronic component (51) that is embedded within the first stacked body; an insulating layer (27) that is stacked on the first stacked body and that has formed therewithin a via conductor (37) having a shape that decreases in diameter from the upper surface side toward the lower surface side thereof; and a second stacked body that is configured by stacking conductive layers (17, 18).

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Inventors:
MAEDA SHINNOSUKE (JP)
Application Number:
PCT/JP2013/005365
Publication Date:
June 19, 2014
Filing Date:
September 11, 2013
Export Citation:
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Assignee:
NGK SPARK PLUG CO (JP)
International Classes:
H05K3/46
Domestic Patent References:
WO2007043714A12007-04-19
Foreign References:
JP2012191204A2012-10-04
JP2006073702A2006-03-16
JP2009200389A2009-09-03
JP2007165810A2007-06-28
JP2011029585A2011-02-10
JP2005311249A2005-11-04
JP2012099610A2012-05-24
Attorney, Agent or Firm:
AOKI, Noboru et al. (JP)
Aoki 昇 (JP)
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