Title:
MULTILAYERED SUBSTRATE AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/276743
Kind Code:
A1
Abstract:
According to the present invention, a first area has a structure in which a layered body is bent along a first polyline line such that a first main surface is positioned peripherally outward of a second main surface. A second area has a structure in which the layered body is bent along a second polyline such that the first main surface is positioned peripherally inward of the second main surface. In the first area, a first metal foil is positioned peripherally outward of the center in the layering direction of the layered body. In the second area, a second metal foil is positioned peripherally outward of the center in the layering direction of the layered body. In the second area, a distance between the second metal foil layer and the second main surface is less than a distance between the second metal foil layer and the first main surface. An angle formed by a first direction and the first polyline is greater than an angle formed by the first direction and the second polyline. An angle formed by a second direction and the second polyline is greater than an angle formed by the second direction and the first polyline.
Inventors:
TAKAHASHI HIRONOBU (JP)
ISONO FUMIYA (JP)
MATSUDA KENJI (JP)
ISONO FUMIYA (JP)
MATSUDA KENJI (JP)
Application Number:
PCT/JP2022/024462
Publication Date:
January 05, 2023
Filing Date:
June 20, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H05K1/02; H05K3/38; H05K3/46
Domestic Patent References:
| WO2014065172A1 | 2014-05-01 | |||
| WO2019194142A1 | 2019-10-10 |
Foreign References:
| JPH0555746A | 1993-03-05 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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