Title:
NONAQUEOUS DISPERSION COMPOSITION, ADHESIVE AGENT COMPOSITION, HEAT-SEAL LACQUER, AND COATING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/182275
Kind Code:
A1
Abstract:
The present invention provides a nonaqueous dispersion composition containing an acrylic resin A, an olefin resin B, and an organic solvent E. The post-heat treatment viscosity of the nonaqueous dispersion composition measured at 25°C after undergoing a heat treatment at 70°C for 1 hour is 20000 mPa·s or less. The acrylic resin A includes a structural unit derived from a (meth)acrylic monomer a. The organic solvent E contains an organic solvent E1 in which the value of the hydrogen bond term δh in the Hansen solubility parameters is 7.0 MPa0.5 or more. The nonaqueous dispersion composition has excellent adhesion force with respect to polyolefin-based base materials.
Inventors:
SHOUJI TAEKO (JP)
Application Number:
PCT/JP2023/010895
Publication Date:
September 28, 2023
Filing Date:
March 20, 2023
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08L23/00; C08F255/02; C08L51/06; C09D5/02; C09D123/04; C09D123/10; C09D133/00; C09J123/04; C09J123/08; C09J123/10; C09J123/14; C09J133/00
Domestic Patent References:
| WO2013080629A1 | 2013-06-06 |
Foreign References:
| JP2004525218A | 2004-08-19 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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