Title:
NOVEL BENZOXAZINE COMPOUND, RESIN STARTING MATERIAL COMPOSITION CONTAINING SAME, CURABLE RESIN COMPOSITION, AND CURED PRODUCT OF SAID CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/026850
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a novel benzoxazine compound which has excellent heat resistance, and is able to be cured under low-temperature conditions; a resin starting material composition which contains this benzoxazine compound; a curable resin composition; and a cured product of this curable resin composition. As a means for solving the problem, the present invention provides a benzoxazine compound that is represented by general formula (1). (In the formula, R1 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; R2 represents an alkylene group having 1 to 6 carbon atoms; and X represents a cycloalkylidene group having 5 to 20 carbon atoms.)
More Like This:
Inventors:
UTAKA YOSHIMI (JP)
Application Number:
PCT/JP2022/030421
Publication Date:
March 02, 2023
Filing Date:
August 09, 2022
Export Citation:
Assignee:
HONSHU CHEMICAL IND (JP)
International Classes:
C07D265/16; C08G14/073; C08G59/50; C08L61/34; C08L63/00
Domestic Patent References:
| WO2018199038A1 | 2018-11-01 | |||
| WO2022163551A1 | 2022-08-04 | |||
| WO2022163553A1 | 2022-08-04 | |||
| WO2022163555A1 | 2022-08-04 |
Foreign References:
| JP2011530570A | 2011-12-22 | |||
| JP2003041001A | 2003-02-13 | |||
| JP2016169362A | 2016-09-23 |
Attorney, Agent or Firm:
YAMADA, Yasuyuki et al. (JP)
Download PDF: