Title:
OLED DEVICE ENCAPSULATION STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/041253
Kind Code:
A1
Abstract:
An OLED device encapsulation structure and manufacturing method therefor. The OLED device encapsulation structure comprises an upper substrate (11) and a lower substrate (12), wherein an OLED working layer (13) is arranged between the upper substrate (11) and the lower substrate (12), the surface of the OLED working surface (13) is provided with an encapsulation layer (14), and the encapsulation layer (14) respectively fits the inner surfaces of the upper substrate (11) and lower substrate (12). The outer surfaces of the upper substrate (11) and lower substrate (12) are respectively provided with a water and oxygen blocking layer (15).
Inventors:
XU DEZHI (CN)
Application Number:
PCT/CN2014/092540
Publication Date:
March 24, 2016
Filing Date:
November 28, 2014
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
HEFEI BOE OPTOELECTRONICS TECH (CN)
HEFEI BOE OPTOELECTRONICS TECH (CN)
International Classes:
H01L51/52; H01L51/56
Foreign References:
| US20130127335A1 | 2013-05-23 | |||
| US20100019664A1 | 2010-01-28 |
Attorney, Agent or Firm:
LIU, SHEN & ASSOCIATES (CN)
北京市柳沈律师事务所 (CN)
北京市柳沈律师事务所 (CN)
Download PDF: