Title:
OPTICAL ASSEMBLY, OPTICAL CHIP, ELECTRONIC DEVICE, AND OPTICAL COMMUNICATION SYSTEM
Document Type and Number:
WIPO Patent Application WO/2024/045805
Kind Code:
A1
Abstract:
An optical assembly, comprising: a fiber array unit (2), comprising a substrate (21) and a plurality of optical fibers (22), the plurality of optical fibers (22) being located on one surface of the substrate (21), and the plurality of optical fibers (22) having an optical fiber end surface (221), wherein the plane where the optical fiber end surface (221) is located is not perpendicular to the plane where the surface of the substrate (21) is located; and an optical chip (3), comprising a substrate (31) and a waveguide layer (32), the substrate (31) having a substrate end surface (311), the waveguide layer (32) being formed on one surface of the substrate (31), and the waveguide layer (32) having a waveguide end surface (322), wherein a non-zero included angle is formed between the substrate end surface (311) and the waveguide end surface (322), and the optical fiber end surface (221) is coupled to the waveguide end surface (322). Also provided are an optical chip, an electronic device, and an optical communication system.
Inventors:
XIAO PENGCHENG (CN)
ZHANG XUEMING (CN)
ZHANG WENQI (CN)
WANG MENG (CN)
ZHANG XUEMING (CN)
ZHANG WENQI (CN)
WANG MENG (CN)
Application Number:
PCT/CN2023/102223
Publication Date:
March 07, 2024
Filing Date:
June 25, 2023
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
G02B6/42; G02B6/30
Domestic Patent References:
| WO2021143910A1 | 2021-07-22 |
Foreign References:
| CN214954237U | 2021-11-30 | |||
| CN104765102A | 2015-07-08 | |||
| CN112698452A | 2021-04-23 | |||
| CN113126217A | 2021-07-16 | |||
| CN113376774A | 2021-09-10 | |||
| CN113791474A | 2021-12-14 | |||
| CN213934310U | 2021-08-10 | |||
| US6879757B1 | 2005-04-12 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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