OPTICAL MODULE

WIPO Patent Application WO/2022/127072

A1

An optical module (200), comprising a first transmitting assembly and a second transmitting assembly. The first transmitting assembly comprises a first heat sink (510), a first lens (520), and a first laser assembly, and the second transmitting assembly comprises a second heat sink (550), a second lens (560), and a second laser assembly, wherein the first lens (520) and the first laser assembly are disposed on the first heat sink (510), and the second lens (560) and the second laser assembly are disposed on the second heat sink (550); the first transmitting assembly and the second transmitting assembly respectively comprise the first heat sink (510) and the second heat sink (550) independent of each other, an independent heat dissipation system can ensure a stable heat dissipation capability, and the normal temperature work of the second laser assembly is not affected on the premise of ensuring that the first laser assembly works at a constant temperature; the first transmitting assembly and the second transmitting assembly are disposed in parallel. By means of the structure having double built-in transmitting assemblies, transmission of signals of double optical paths can be achieved, the space utilization rate of BOSA is facilitated to improve, and the high integration of CPON is facilitated to achieve.

ZHANG XIAOLEI (CN)
LIU XUERU (CN)
TANG YI (CN)

PCT/CN2021/103116

June 23, 2022

June 29, 2021

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HISENSE BROADBAND MULTIMEDIA TECHNOLOGY CO LTD (CN)

H04B10/50; H01S5/02253; H01S5/023; H01S5/024

CN111965770A	2020-11-20
CN210294612U	2020-04-10
CN108039643A	2018-05-15
CN211603627U	2020-09-29
CN104836619A	2015-08-12
US20050008049A1	2005-01-13

TDIP & PARTNERS (CN)

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