OPTICAL MODULE

WIPO Patent Application WO/2022/127073

A1

An optical module (200), comprising a circuit board (300) and a light emitting assembly (401). The light emitting assembly (401) comprises a ceramic substrate (601), an EML laser assembly and at least two channels. One channel comprises a drive assembly, a drive multiplexing pad (6042), a drive power supply pad (6044) and an EML multiplexing pad (6052), wherein the drive multiplexing pad (6042) is provided near a drive chip (602) to ensure the normal operation of the drive chip (602); the main function of the drive multiplexing pad (6042) is to provide a first voltage to the drive chip (602) and to implement signal transmission to an EML laser chip (603); the main function of the drive power supply pad (6044) is to provide a second voltage to the drive chip (602); and the main function of the EML multiplexing pad (6052) is to provide a voltage to the EML laser chip (603) and to ensure that the EML laser chip (603) receives a signal from the drive chip (602). The normal operation of the drive chip (602) and the EML laser chip (603) is ensured by arranging a multi-channel drive peripheral circuit and EML peripheral circuit on the ceramic substrate (601).

ZHANG JIAAO (CN)
WANG XINNAN (CN)
YU LIN (CN)
MU JIANWEI (CN)

PCT/CN2021/103117

June 23, 2022

June 29, 2021

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HISENSE BROADBAND MULTIMEDIA TECHNOLOGY CO LTD (CN)

G02B6/42

CN112505855A	2021-03-16
CN110780397A	2020-02-11
CN111522103A	2020-08-11
CN109417272A	2019-03-01
CN110178065A	2019-08-27
CN204906401U	2015-12-23
US6057954A	2000-05-02

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