Title:
ORGANIC SILICONE RESIN ALUMINUM BASE COPPER CLAD LAMINATE AND PREPARATION METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/028383
Kind Code:
A1
Abstract:
The present invention relates to an organic silicone resin aluminum base copper clad laminate and preparation method thereof. The aluminum base copper clad laminate comprises sequentially a copper foil layer, an insulation layer and an aluminum plate layer, wherein, the insulation layer is prepared from an organic silicone resin composition, and the organic silicone resin composition comprises the following components in parts by weight: 100 parts of an organic silicone resin, 40-100 parts of a vinyl-terminated silicone oil, 0.0001-0.5 parts of a catalyst and 0.00001-0.1 parts of an inhibitor. By adopting an organic silicone resin as a substrate polymer, the electrical insulation and heat resistance functions of the aluminum base copper clad laminate are improved. Moreover, the vinyl-terminated silicone oil as reactive diluent can effectively reduce brittleness of a silicone resin, improving the toughness of the organic silicone resin composition. The aluminum base copper clad laminate has advantageous electrical insulation, heat-conduction, high-temperature resistance and resistance to long-term aging.
Inventors:
TANG GUOFANG (CN)
YE SUWEN (CN)
YE SUWEN (CN)
Application Number:
PCT/CN2015/094879
Publication Date:
February 23, 2017
Filing Date:
November 18, 2015
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
B32B15/08; C08L83/07; C08K3/22; C08L83/05; H05K1/05
Foreign References:
| CN101919320A | 2010-12-15 | |||
| CN101712800A | 2010-05-26 | |||
| US5741439A | 1998-04-21 | |||
| JP2005281509A | 2005-10-13 |
Other References:
See also references of EP 3315559A4
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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