Title:
OUTER PACKAGE MATERIAL FOR POWER STORAGE DEVICES, METHOD FOR PRODUCING SAME, AND POWER STORAGE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/058701
Kind Code:
A1
Abstract:
This outer package material for power storage devices is formed of a laminate comprising at least a substrate layer, a barrier layer, and a thermally fusible resin layer in the stated order. A DSC curve measured for the thermally fusible resin layer by using a differential scanning calorimeter has at least one melting peak temperature in the range of 115-130°C. A Martens hardness is 8.5-11.0 MPa, as measured in accordance with an indentation method, at a measurement temperature of 110°C, by inserting a Vickers indenter in the thickness direction to the depth of 1 μm from the surface on the thermally fusible resin layer side of the outer package material for power storage devices.
Inventors:
MURASAWA KEN (JP)
Application Number:
PCT/JP2022/037361
Publication Date:
April 13, 2023
Filing Date:
October 06, 2022
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
H01M50/134; B32B27/00; H01G11/78; H01M50/105; H01M50/121; H01M50/129; H01M50/131
Domestic Patent References:
| WO2021201293A1 | 2021-10-07 |
Foreign References:
| JP2019029300A | 2019-02-21 |
Attorney, Agent or Firm:
TANAKA, Junya et al. (JP)
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