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Title:
PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/129666
Kind Code:
A1
Abstract:
[Problem] To provide: a package for housing an electronic component, wherein a metal part formed of a getter metal material exhibits high bonding strength to an insulating base; and an electronic device. [Solution] A package for housing an electronic component, which is provided with: a substrate part that comprises an insulating base (1), which is formed of a ceramic sintered body and comprises a recess (2), and a wiring conductor (5) which is provided on the insulating base (1); and a metal part (3) which is formed of a sintered body of a getter metal material and is directly bonded to the recess (2). An electronic device which is provided with this package for housing an electronic component and an electronic component (6) which is housed within the recess (2).

Inventors:
NIINO NORITAKA (JP)
Application Number:
PCT/JP2014/054590
Publication Date:
August 28, 2014
Filing Date:
February 25, 2014
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/26
Domestic Patent References:
WO2013008919A12013-01-17
WO2010010721A12010-01-28
Foreign References:
JPS53128291A1978-11-09
JP2010040767A2010-02-18
JP2006086585A2006-03-30
JPH08236660A1996-09-13
JP2003254820A2003-09-10
JP2000227920A2000-08-15
Other References:
See also references of EP 2960935A4
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