Title:
PACKAGE FOR HOUSING ELECTRONIC COMPONENT, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2022/163502
Kind Code:
A1
Abstract:
A package for housing an electronic component according to the present disclosure includes an insulated substrate, an external connection conductor, and a corner conductor. The insulated substrate has a first face having a mounting region for an electronic component, a second face situated on the opposite side from the first face, a first side face connecting the first face and the second face, a second side face connecting the first face and the second face and continuing to the first side face, and a corner portion at which the first side face and the second side face intersect. The external connection conductor is located at the second face. The corner conductor is located from the external connection conductor toward the corner portion, with a spacing as to the external connection conductor gradually increasing from the external connection conductor toward the corner portion, and has an exposed portion that is exposed at the first side face and the second side face excluding the corner portion.
Inventors:
KISAKI TAKUO (JP)
Application Number:
PCT/JP2022/002059
Publication Date:
August 04, 2022
Filing Date:
January 20, 2022
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/04; H01L23/12
Domestic Patent References:
| WO2017126596A1 | 2017-07-27 | |||
| WO2020262472A1 | 2020-12-30 | |||
| WO2021106655A1 | 2021-06-03 |
Foreign References:
| JP2005050935A | 2005-02-24 |
Attorney, Agent or Firm:
SAIKYO, Keiichiro (JP)
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